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ABOUT

BO STEPHENS

I have been an executive and major shareholder in a packaging design, manufacturing and distributor corporation, making decisions based on patented, proprietary products and inventions I created, working in every possible packaging discipline including corrugated, foam, injection molded / vacuum formed tooling and plastics, ESD related products, films, environmental, recycled, and reusable materials, etc. I have been a packaging engineer at three different manufacturers of electronic hardware and software, a sales engineer, and a consultant to many major electronics and medical companies spanning 35 years. I have excellent relationships with most of the large suppliers based on my years competing against them and purchasing from them. In my years, I’ve specialized in the creation and adherence of sustainable material selection as the forefront of my designs. The respect I’ve earned is based on years of hard work; I am known as an honest, cerebral, well-rounded engineer who can do the job efficiently at an executive level, and anyone who works for or with me is held to the same value standard.

APPLICATION

  • 100% Sustainable, Recyclable, Reusable materials
  • Global manufacturing knowledge and relationships
  • Partnered in house design, sampling and manufacturing
  • Work thru existing vendor or provide new base

ACCOMPLISHMENTS

  • R.S.V.P. Inc. Technology: Co-invented and patented the first fragility packaging product made from thermoformed plastic sheet (100% recycled HDPE) revolutionizing the packaging industry, resulting in $500 MILLION annual sales potential. It is now the world-wide disk drive standard and with the new corner block designs providing further cost reductions, it should replace EPS and EPE in fragile environments by the turn of the century. The Designs won two Gold medals; at WestPack Expo and The WorldStar Competitions with IBM as the partner. The following savings have been realized:
    • Arista Networks Global Packaging Development in 100% sustainable materials on 5 continents. $10M/yr for last 8 years in savings while they grew from $50M to $4B in sales.
    • Quantum Disk Drives: $10 Million per annum in packaging, damage reduction, freight, and storage.
    • Motorola Jedec Trays: $20 Million per annum in damage reduction, freight, and storage; $500,000 in packaging cost, two products only
    • Apple Material Handling Trays (Plastic Covers): $500,000 in packaging cost per annum due to reusing.
    • IBM Drives: $50 Million per annum with Reflex Packaging.
    • Seagate / Conner: $2.5 Million per annum.
    • Intel MMX Pentium Upgrades: Millions per annum in freight reduction.
    • Iomega Zip Drives: $3 Million per annum in savings in packaging cost due to reusing, freight and storage savings.
  • Quantum Disk Drive Pallet Pack: $8 Million per annum due to redesign of package and throughput.
  • Apple Computer Recycle / Reusable Programs: $1.8 Million per annum at Fremont and Colorado plants in cost, palletization, damage reduction, storage, and freight. Systems integration with all of Apple suppliers of incoming components was utilized.
  • Conner Disk Drives: $1.3 Million per annum in damage reduction, freight, storage, and cost.
  • Motorola Consulting; Austin, Texas plant: Material Handling and Outgoing Packaging proposal reduced DOA damage in shipment stream (Malaysia to Texas) from $20 Million per month to $2 Million per month, taking just 3 months to implement.
  • As Packaging Sales Engineer, Vice President of Design: Reached goal of $1 Million per year in first year as salesman escalating to $4 Million after three years. Industry standard at that time was $750,000.
  • As Packaging Engineer, Manufacturer (2): Reduction in costs by 50% with %75 decrease in product damage and 60% decrease in storage requirements.